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2019 Review

The rise of 2D dielectrics/ferroelectrics

投稿日:

M. Osada, T. Sasaki
APL Materials 7 (12), 120902 (2019).
Editor's choice. Featured in cover.

Ultrathin films with high-k dielectric/ferroelectric properties form the basis of modern electronics. With further miniaturization of electronic devices, conventional materials are expected to experience a challenge because of their critical thickness, where the dielectric/ferroelectric responses are unstable or even disappeared if the film thickness is reduced to the nanometer scale or below a two-dimensional (2D) limit. Owing to the benefit of preparing stable atomically thin film, 2D materials present tantalizing prospects for scaling high-k dielectric/ferroelectric technologies down to the actual atomic scale. Here, we review recent progress in 2D dielectrics/ferroelectrics and related device applications.

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